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TECHNOLOGY

TECHNOLOGY

Innovation

    Wafers are processed one by one.

  • - Oxidation aperture sizes are controlled by the process time
  • - Issues on non-uniform oxide aperture size on a wafer and on low reproducibility between wafer to wafer
  • - Even with in-situ monitoring tools, it is not possible to solve Issues on non-uniform oxide aperture size on a wafer
  • - Issues on the stable quality control and improving production yields of VCSEL products.

    Multiple wafers can be process at once.

  • - A physically limited and self-terminated oxidation process allows stable and uniform process
  • - Able to achieve uniform oxide aperture sizes on wafer, wafer to wafer, and batch to batch process
  • - Allows dramatic improvement in VCSEL production yields
  • - Improved production throughput is possible as well
  • - Expect to improve the VCSEL chip reliabilities especially on high power applications.
  • Phone:+86 21 62781056
  • E-mail:shishenhui@ascore-tech.com
  • Address:Room 1610, No. 2 Building, Yinghua Plaza, No. 2899 Guangfu West Rd., Shanghai
  • Zip:200062

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